We open the device and extract the motherboard from the device and treat it in an ultrasonic cleaner to remove rust and oxidation from the board. We dry out the remaining components of the device while the motherboard is being treated. Once the treatment is complete, we reassemble the board to the device and test all components. Replacement of some parts may be required to bring the device back to functionality.
Here are some things that you should do prior to bringing in your device:
Do not turn on the phone. Electrical components don’t play well with water when operating.
Don’t plug it in either! For the same reason.
Don’t press any keys. This can push water further into the phone. It’s best to try to mess with the phone as little as possible.
Don’t shake or blow into the device. This could also push water into deeper areas of the phone. Especially try to avoid blow dryers – not only because of the blowing
part, but also because of the following point….
Do not apply any heat to the phone. Remember excessive heat can also damage the phone. You don’t want to add more damage!
Don’t move the phone around too much. Same deal; you don’t want the water moving around inside the phone.